Doctech HK Limited

Doctech HK Limited is a pioneering company specializing in surface metal treatment technologies, chemical additives, and advanced materials for semiconductor packaging. The company focuses on researching, manufacturing, and selling metal electroplating materials and specialty chemicals used in high-tech manufacturing. Doctech specializes in developing copper metallization technologies for 3D chip stacking and advanced chip packaging applications. Their solutions offer superior uniformity, high purity, excellent through-hole filling, and cost-effective manufacturing. Based on the newly developed nanotwin copper material, Doctech provides forward-looking material breakthroughs for future 3D integrated circuit packaging, mainly used for redistribution copper layers, copper metal interconnections, and copper micro-pillars in consumer electronics products. Doctech aims to be a supplier of the next generation of electroplating chemicals and technologies, serving the semiconductor manufacturing and packaging industries.